Achi Ir6500 Software Work Link
The IR6500 introduces several significant hardware improvements over its predecessor.
Monitor real-time temperature graphs for both the top heater and bottom preheater.
Control the execution (Start/Stop) of a rework cycle directly from a computer. achi ir6500 software
The BGA rework station primarily uses IRsoft (often referred to as the PC410 software) to interface with its programmable temperature controller. This software allows you to bypass the hardware's onboard limits—storing only 10 programs with eight steps each—by managing an unlimited number of complex temperature profiles directly from a computer. Key Features of IRsoft
Target: Lead-free BGA rework (solder melting point ~217°C). The BGA rework station primarily uses IRsoft (often
The Achi IR6500 software may be used in various industries, such as:
The Achi IR6500 software offers a range of innovative features that enhance the functionality of the Achi IR6500 thermal imaging camera. Some of the key features include: The Achi IR6500 software may be used in
The primary reason to use the software is to program . A typical BGA reflow profile consists of several segments defined by Ramp Rate (r) , Target Temperature (L) , and Dwell/Hold Time (d) . Target Temp (Leaded) Target Temp (Lead-Free) 1. Preheat Slowly warms the chip and board to prevent thermal shock. 100°C–120°C 130°C–150°C 2. Soak Activates the flux and ensures uniform heat distribution. 140°C–150°C 150°C–180°C 3. Ramp Rapidly climbs toward the melting point of the solder. 160°C–170°C 190°C–210°C 4. Reflow Reaches peak temperature to liquify the solder balls. 185°C–190°C 225°C–235°C 5. Cooling Solidifies the solder safely to avoid brittle joints. Controlled drop Controlled drop How to Program a Profile in the Software: Open the Profile Editor in ACHI IR Soft. Input your parameters into the matrix. For example: r1 = 1.00 (Raise temperature by 1°C per second) L1 = 120 (Target 120°C) d1 = 40 (Hold at 120°C for 40 seconds) Repeat this process for segments 2 through 5.
